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OE-A Roadmap for Flexible and Printed Electronics - Whitepaper 2026 edition

The 10th Edition of the OE-A Roadmap presents the latest industry-wide insights into flexible and printed electronics. The Roadmap supports the strategic planning of the industry, academia, and politics. 

This white paper highlights the growing penetration of FPE across key industry sectors including automotive, consumer electronics, healthcare, packaging, smart buildings, IoT, as well as emerging fields such as defense and aerospace. This edition also addresses the increasingly important topics of sustainability and circularity. In addition, the roadmap provides a concise overview of the enabling technologies that drive these applications, including devices and the underlying technology clusters with expanded insights into standardization.

  • For any question, please contact Raswanth Sendhil Sasikala - raswanth.sendhilsasikala@oe-a.org (+49 15121971604)
  • This study will be published in the range of April /  Mai 2026
  • The 2026 edtion will be digital only

Content

1. Executive summary 
2. About the OE-A Roadmap 
 2.1. Structure and Process 
 2.2. Technology and Manufacturing Readiness Levels 
 2.3. Sustainability / Green Electronics 
  2.3.1. Green Electronics and Electronics for Green 
  2.3.2. EU Project Landscape 
  2.3.3. Best Practices for Green and Sustainable Flexible and Printed Electronics 
  2.3.4. Future Directions 
3. Industrial Themes 
 3.1 Automotive 
 3.2 Consumer Electronics 
 3.3 Healthcare 
 3.4 Printing & Packaging 
 3.5 Smart Buildings 
 3.6 Internet of Things 
 3.7 Defense and Aerospace 
  3.7.1 Defense 
  3.7.2 Aerospace 
4 Enabling Technologies 
 4.1 Devices 
  4.1.1 Flexible and OLED Displays 
  4.1.2 Electronics and Components Cluster 
   4.1.2.1 Energy Generation & Storage 
    4.1.2.1.1 Organic & Perovskite Photovoltaics 
    4.1.2.1.2 Flexible Batteries and Printed Supercapacitors 
    4.1.2.1.3 Fuel Cells 
   4.1.2.2 Active Devices 
   4.1.2.3 Passive Devices 
  4.1.3 Integrated Smart Systems and Hybrid Electronics Cluster 
   4.1.3.1 Smart Objects and Sensors 
   4.1.3.2 Smart Textiles 
   4.1.3.3 D Structural Electronics 
  4.2 Technology Clusters 
   4.2.1 Functional Materials 
   4.2.2 Substrate Materials 
   4.2.3 Printing, Coating and Patterning Techniques 
   4.2.4 Assembly 
   4.2.5 Testing and Standardization 
   4.2.6 Design and Simulation

Productinfo

EAN 9783816307761
Authors Editors: Donald Lupo, Tampere University; Giovanni Nisato, Innovation Horizons; Michael Olk, IEE; Klaus Hecker, OE-A; Raswanth Sendhil Sasikala, OE-A
ISBN 978-3-8163-0776-1
Page count 313
Language of Content EN